3M™ 1183 Tin-Plated Copper Foil EMI Shielding Tape

3M™ Tin-Plated Copper Foil EMI Shielding Tape 1183 is a flame-retardant, high-performance tape designed for EMI shielding, static charge draining, and grounding. It features a dead soft tin-plated copper foil backing that resists oxidation and enables easier soldering. It also includes a conductive acrylic pressure-sensitive adhesive that ensures strong and consistent electrical contact from substrate to backing. The tape is a reliable choice for demanding environments requiring effective EMI shielding performance.

Applications include: EMI shielding in electronics and enclosures, static charge drainage, grounding and gasketing, shielded room construction.

Technical Datasheet
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  • Flame-retardant and oxidation-resistant for enhanced durability
  • Enables easy soldering and reliable electrical contact
  • Excellent EMI shielding, grounding, and static charge drainage
  • Ideal for electronics, enclosures, gasketing, and shielded room applications
Property Specification
Backing (Carrier) Material 1.4 mil dead soft tin-plated copper foil
Adhesive Material 1.2 mil Conductive Acrylic PSA
Adhesion to Steel (D3330) 25 oz/in
Tensile Strength (kPa)
Tensile Strength (PSI)
Elongation at Break
Shielding Effectiveness (Average 300kHz - 2.5GHz) 68dB
Product Color Matte Tin
Insulation Resistance ≤ 0.005 Ω/in²
Certifications UL 510A Recognized (File E17385)
Thickness (Imperial) 2.66 mil
Thickness (Metric) 0.068mm
Maximum Operating Temperature (Celsius) 130°C
Maximum Operating Temperature (Fahrenheit) 266°F
Minimum Operating Temperature (Celsius) -40°C
Minimum Operating Temperature (Fahrenheit) -40°F