3M™ 1183 Tin-Plated Copper Foil EMI Shielding Tape
3M™ Tin-Plated Copper Foil EMI Shielding Tape 1183 is a flame-retardant, high-performance tape designed for EMI shielding, static charge draining, and grounding. It features a dead soft tin-plated copper foil backing that resists oxidation and enables easier soldering. It also includes a conductive acrylic pressure-sensitive adhesive that ensures strong and consistent electrical contact from substrate to backing. The tape is a reliable choice for demanding environments requiring effective EMI shielding performance.
Applications include: EMI shielding in electronics and enclosures, static charge drainage, grounding and gasketing, shielded room construction.
- Flame-retardant and oxidation-resistant for enhanced durability
- Enables easy soldering and reliable electrical contact
- Excellent EMI shielding, grounding, and static charge drainage
- Ideal for electronics, enclosures, gasketing, and shielded room applications
| Property | Specification |
| Adhesive Material | Silicone |
| Backing (Carrier) Material | Polyimide |
| Maximum Operating Temperature (Celsius) | 260 °C |
| Maximum Operating Temperature (Fahrenheit) | 500 °F |
| Product Color | Amber, Dark Amber |
| Total Tape Thickness without Liner (Imperial) | 3.3 mil |
| Total Tape Thickness without Liner (Metric) | 0.08 mm |
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