CHR C665

Saint-Gobain® CHR® C665 Copper Foil Tape

CHR® C665 Copper Foil Tape features an electrically deposited copper foil backing paired with a conductive acrylic adhesive. This construction is designed to deliver electrical conductivity through the entire tape structure, supporting EMI/RFI shielding and grounding performance in electrically demanding environments.

Applications include: A diverse range of markets including electronics, electrical, transportation, aerospace, and general industrial, where full-construction conductivity is required for shielding, grounding, and static dissipation in IC chips, electrical cabinets, cables, and motors.

 
 
  • Conductive copper foil backing and conductive acrylic adhesive enable electrical continuity through the entire tape construction
  • Engineered to support EMI/RFI shielding and grounding applications where conductivity across the bond line is required
  • Conformable foil construction allows the tape to adapt to complex or irregular surfaces
  • Supplied with a release liner to support precision die cutting and custom converting
  • Provides effective sealing against radiated and leaked electromagnetic interference
  • Solvent resistance to maintain performance in demanding operating environments
  • Recognized under the UL component program, Guide OANZ2, File E51201
  • Meets UL510 flame-retardant requirements
Property Specification
Backing (Carrier) Material 1.5 mil copper foil
Adhesive Material 2.0 mil Acrylic
Total Thickness (Imperial) 3.5 mil
Total Thickness (Metric) 0.089mm
Adhesion to Steel (D3330) 35 oz/in
Tensile Strength (kPa) 483 kPa
Tensile Strength (PSI) 70 psi
Elongation at Break
Shielding Effectiveness (Average 300kHz - 2.5GHz)
Product Color Copper
Insulation Resistance
Certifications UL 510 Recognized (File E51201)
Maximum Operating Temperature (Celsius) 121 °C
Maximum Operating Temperature (Fahrenheit) 250 °F
Minimum Operating Temperature (Celsius) -40 °C
Minimum Operating Temperature (Fahrenheit) -40 °F